|
温度领域 Temperature Range |
0℃~800℃ |
面板尺寸 Panel Size |
G3.5-G8.6 |
|
升温速度 Heating Rate |
<80℃/min |
面板翘曲 Panel Warpage |
≤0.1mm |
|
降温速度 Cooling Rate |
<60℃/min |
收缩率 Shrinkage Rate |
X≤12ppm，Y≤12ppm |
|
温度均匀性 Temperature Uniformity |
≤±3℃ | Particle | ≥1um，≤100ea |
EN 
